Darrell Smith

About me:

The information about me is as follows. 1. I am currently the President & CEO of DESHEN Pacific, Inc. DESHEN Pacific is a Nevada-based C-Corporation (which I started back in 2003) that was originally created to manage some Limited Partnerships and LLCs that owns and operates rental property in various states across the U.S. More recently (since resigning from Exar Corporation) DESHEN Pacific has also evolved into a Sales Rep company that markets and sells Green Technology/Energy Saving products. We sell the following types of products. A. Energy Management systems for Residential Applications (e.g., Single-Phase 120V/240V - 200A Circuit Breaker Panel). This is a product that does three things. a. It will reduce the amount of electrical energy that you (or your household) pulls from the electrical grid, by as much as 23%. NOTE: For my customers, I have typically seen an 8 to 15% reduction. b. It will protect your electronics and appliances from damage due to spike and surge events. c. It will extend the life and improve the performance of your electronics by filtering out much of the electrical noise in the power lines in your home. B. Energy Management systems for Commercial (3-Phase 208V/240V/480V Delta and Wye) Applications. We have an array of products that can be deployed into Commercial Applications. In all, these products do the same things as does the Residential Product (e.g., Energy Savings, Surge/Spike Protection and Electrical Noise Filtering). 2. From January 1994 through January 2007, I worked for a mixed-signal semiconductor company called Exar Corporation. For the last 6 years that I was at Exar, I was the Director of Applications Engineering. During my tenure at Exar, the company developed Telecommunication ICs that supported the following data-rates/protocols. - T1/E1 - T3/E3 - SONET/SDH - ATM (over DS3, E3 and SONET/SDH) - PPP (over DS3, E3 and SONET/SDH) - Mapper chips (which mapped 12 DS3/E3/STS-1/STM-0 Channels into an STS-12/STM-4 signal). - Mapper chips (which VT-mapped 28 DS1s or TU-mapped 21 E1s) into an STS-1/STM-0 signal. My mission was to develop and manage a team of Engineers to provide Hardware and Software Design support to our customers and attempt to make the experience of designing systems (with our chips) as painless as possible. My team was also responsible for creating and providing much of the technical documentation on our products as well.